PCBA processing
production capacity
There are 4 SMT patch production lines, equipped with newly imported Samsung S1 S2 high-speed patch machine, full-automatic solder paste printing machine, ERSA ten-temperature zone reflow furnace, AOI, SPI, x-ray and other high-end equipment, especially good at high precision and high complexity veneers, and have actual performance in producing ultra-complex veneers.
| SMT Nissan Energy | 2.4 million Point | |
| SMT production line | 4 | |
| Throwing rate | Resistance-capacitance rate 0.3% | |
| Class IC without material throwing | ||
| veneer type | POP/ordinary board/FPC/rigid-flex bonding board/metal substrate | |
| Mount Component Specifications | Smallable package | 01005 Chip/0.4 Pitch BGA |
| Minimum device accuracy | ±0.04mm | |
| IC class patch accuracy | ±0.03mm | |
| Mounted PCB Specifications | PCB Dimensions | 50*50mm - 610*510mm |
| PCB thickness | 0.3-6.5mm | |
| Process flow and capacity | Hold an order review meeting before the product goes online to warn the occurrence of problems in advance and provide solutions. | |
| Evaluate the opening requirements of steel mesh fixtures and reverse control the occurrence of supplier defects. | ||
| Process engineers cooperate with production to solve process anomalies. | ||
| In view of the unreasonable design of the customer, the corresponding summary report of the trial production problem will be given to help the customer optimize the design. | ||
| Quality control ability | ① Intelligent first piece detector | Detection of wrong material, leakage, polarity, direction, silk screen, etc., mainly used in the first piece of detection. |
| ② SPI-Automatic 3D Solder Paste Thickness Gauge | Detecting all kinds of solder paste printing quality problems such as missing printing, less tin, more tin, even tin, deviation, poor shape, board surface pollution, etc. | |
| ③ AOI | 2D/3D AOI test and match to detect various problems after mounting: short circuit, leakage, polarity, displacement and wrong parts. | |
| ④ Xray | 3D X-RAY operation detection is matched with random inspection of 2D X-RAY to detect open circuit and short circuit of BGA, QFN and other devices. | |
Processing flow
Production Workshop
Products
PRJ-2
IMG_7075
IMG_4991
IMG_3028
IMG_1945
F252D-V00-A
F203-V30-A0
DIP
673246-02-WX-A
673102-WX-A
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