We can provide various types of PCB production, and can meet customer sample, small and medium-sized batch of PCB rapid manufacturing services.
PCB plate making capability | Maximum number of floors: 40; |
| Minimum line width/line spacing: 3mil/3mil |
| Maximum copper thickness: 10 OZ |
| Minimum aperture: mechanical drilling: 4mil Laser drilling: 3mil |
| Maximum thickness diameter ratio: 18:1 |
| Impedance control tolerance: ± 5% |
| Profile tolerance: ± 0.1mm |
| Materials: FR4, high Tg, halogen-free, ceramic filling, PI, BT, PPO, PPE, PTFE, high-frequency/microwave (Rogers, Taconic, Arlon, F4B), metal base/core (aluminum, copper, iron), metal based/core |
| Surface treatment: HASL, OSP, electrolytic gold, gold, silver, tin |
Special processing: rigid flexure bonding, buried magnetic core, buried optical fiber, buried capacitance/resistance, third-order stacked hole HDI, hole plate in disk, inner/outer hollow plate, high TG thick copper, mixed compression, local mixed compression, multi surface coating, metal substrate/core plate, plate edge
Metallization, buried hole, blind hole, step groove, local high-density, back drilling, impedance control, etc |
